Cross-edge microfabrication CuW submount
Sub-mount capable of controlling sharp edges and warping.
The "CuW Submount" is a submount for heat sink applications of high-output LD modules. It allows for control of sharp edges and warping to achieve alignment during LD bonding and efficient heat dissipation. Additionally, it enables control of excess solder during AuSn deposition in the LD bonding area. 【Features】 ■ Control of sharp edges and warping is possible ■ Control of excess solder is possible ■ Suitable for high-output semiconductor lasers *For more details, please refer to the PDF document or feel free to contact us.
- Company：テクニスコ
- Price：Other
